The characteristic of thermosetting polyphenylene oxide resin copper clad laminates as wel as their application in the high frequency printed circuit board is introduced.

论述了热固性聚苯醚树脂基覆铜板的特性及其在高频印刷电路板上的应用。

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This paper established the high-frequency models of resistors, capacitors, inductors, diodes and transistors, and extracted the high frequency distribution parameters of printed circuit board.

然后建立了电阻、电容、电感、二极管、三极管、变压器和印刷线路板的高频模型，并提取模型参数。

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Cyanate compound, the preparation of triazine copper clad panel and 1ts application in high frequency printed circuit board were introduced in this paper.

本文介绍了氰酸酯化合物，三嗪覆铜板的制备及其在高频线路板上的应用。

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